Macro and command execution from memory array

ABSTRACT

Methods and apparatus for executing internal operations of memory devices utilizing instructions stored in the memory array of the memory device are disclosed. Decode blocks adapted to interpret instructions and data stored in the memory device are also disclosed. Methods can be used to perform internal self-test operations of the memory device by executing test procedures stored in the memory array of the memory device performing a self-test operation.

RELATED APPLICATIONS

This Application is a Divisional of U.S. application Ser. No.12/261,857, titled “MACRO AND COMMAND EXECUTION FROM MEMORY ARRAY,”filed Oct. 30, 2008, (allowed) now U.S. Pat. No. 8,095,834 which iscommonly assigned and incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates generally to memory devices and inparticular the present disclosure relates to internally executinginstructions and commands stored in the array of a memory device.

BACKGROUND

Memory devices are often provided as internal storage areas inelectronic devices such as personal computers (PCs), digital cameras andcellular telephones. In general, memory devices contain an array ofmemory cells for storing data, and row and column decoder circuitscoupled to the array of memory cells for accessing the array of memorycells in response to an external address.

One type of memory is a non-volatile memory known as FLASH memory. FLASHmemory is a type of EEPROM (electrically-erasable programmable read-onlymemory) that can be erased and reprogrammed in blocks. Many modernpersonal computers (PCs) have their BIOS stored on a FLASH memory chipso that it can easily be updated if necessary. Such a BIOS is sometimescalled a FLASH BIOS. FLASH memory is also popular in wireless electronicdevices because it enables the manufacturer to support new communicationprotocols as they become standardized and to provide the ability toremotely upgrade the device for enhanced features. FLASH memorytypically utilizes one of two basic architectures known as NOR FLASH andNAND FLASH. The designation is derived from the logic used to read thedevices.

As with most types of memory, including FLASH memory, it is desirable totest and verify the memory device during the development phase of adevice, as part of the manufacturing process of the device and finallyby the end user of the memory device.

During the development phase of a memory device, development prototypedevices are often made which have additional memory circuitry used tostore test instructions and commands. This additional memory circuitryis often hard coded and therefore changing or updating the testinstructions and commands can be time consuming and labor intensive. Inaddition, this additional circuitry can consume large amounts of realestate on a device and therefore must be removed for production versionsof the chip.

During the production phase of a memory device, device testing can betedious and time consuming because the process often requires a testoperator utilizing some type of probing device to verify the operationof each memory device. This consumes time and resources which can add upto significant costs. Thus, having the capability of performing selftest operations on a memory device would improve time to market,increase production rates and generally reduce the overall cost ofmemory devices.

For the reasons stated above, and for other reasons stated below whichwill become apparent to those skilled in the art upon reading andunderstanding the present specification, there is a need in the art formemory devices to perform self test operations.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a functional block diagram of a prior art memory deviceutilizing SRAM.

FIG. 2 is a functional block diagram of a prior art memory deviceutilizing metal ROM non-volatile memory.

FIG. 3 is a functional block diagram representation of executing a macrofrom a memory array according to one embodiment of the disclosure.

FIG. 4 is a functional block diagram representation of executing acommand and macro from a memory array according to one embodiment of thedisclosure.

FIG. 5 is a functional block diagram representation of executing aninternal instruction and macro from a memory array according to oneembodiment of the disclosure.

FIG. 6 is a flow chart of a method for testing memory cells of a memorydevice having a multiple bank architecture according to an embodiment ofthe present disclosure.

FIG. 7 is a flow chart of a method of testing memory cells of a memorydevice having a single bank architecture according to an embodiment ofthe present disclosure.

FIG. 8 is a flow chart of a method for testing memory cells of a memorydevice having a single bank architecture according to another embodimentof the present disclosure.

FIG. 9 is a functional block diagram representation of a memory deviceincorporating multiple embodiments of the present disclosure.

FIG. 10 is a functional block diagram of an electronic system having atleast one memory device according to an embodiment of the presentdisclosure.

DETAILED DESCRIPTION

In the following detailed description of the embodiments, reference ismade to the accompanying drawings that form a part hereof In thedrawings, like numerals describe substantially similar componentsthroughout the several views. These embodiments are described insufficient detail to enable those skilled in the art to practice theinvention. Other embodiments may be utilized and structural, logical,and electrical changes may be made without departing from the scope ofthe present invention.

The following detailed description is, therefore, not to be taken in alimiting sense, and the scope of the present disclosure is defined onlyby the appended claims, along with the full scope of equivalents towhich such claims are entitled.

There are many different types of memory including by way of examplerandom-access memory (RAM), read only memory (ROM), dynamic randomaccess memory (DRAM), synchronous dynamic random access memory (SDRAM),and FLASH memory. Most memory devices are comprised of an array ofmemory cells for storing data permanently (ROM) or temporarily (RAM.)These devices also typically have control circuitry to manage functionsrequired to interact with the memory array. State machines are oftenutilized to facilitate the operation of the memory device. These statemachines often have some type of ROM associated with them.

FIG. 1 illustrates a prior art memory device 100 having a state machine102, an array of memory cells 104, SRAM 106, a data cache 108 and acontrol register 110. The memory device in FIG. 1 also contains aRegister Data (‘REG_DAT’) 112 bus, a Register Address (‘REG_ADD’) 114bus and a Write Register (‘WRT_REG’) 116 signal. The memory device 100in FIG. 1 utilizes SRAM 106 to store test instructions and commands.These test instructions and commands are then used by the state machine102 such as during the development phase of a memory device. UtilizingSRAM 106 to provide the test instructions and commands to the statemachine 102 is only practical in test and development chips due to thelarge amount of real estate on the die that SRAM 106 consumes whichtherefore destroys the array efficiency of the chip.

FIG. 2 illustrates a prior art memory device 200 having a state machine202, a memory array 204, non-volatile metal ROM 206 that includesinstruction ROM (‘IROM’) 210 and macro ROM (‘MROM’) 212, a data cache208 and a control register 214. The memory device 200 also contains aregister data 216 bus, a register address 218 bus and a write register220 signal. The IROM 210 might store instructions that direct the statemachine 202 on how to apply macros to carry out a desired algorithm orfunction. Macros are typically lower level internal instructions such asa particular series of individual register manipulations to beperformed. Functionality of memory devices is often effectuated bysetting register values in the device which in turn control theoperation of the device. These device control registers are oftenlocated in what is known in the art as a control register 214. Macrosare typically stored in the MROM 212. Upon receiving a valid command,the state machine 202 typically loads instructions from the IROM 210along with macros from the MROM 212. During the development phase of amemory device, these instructions and macros may be programmed into theIROM 210 and MROM 212 to help facilitate testing and operation of thenew device. During the production phase, the IROM 210 and MROM 212 mightbe programmed with instructions and macros used by the device 200 whilein normal operation.

Currently, if a change in the IROM 210 or MROM 212 is needed or desired,a new metal mask must be created and used to fabricate a new run ofdevices. Implementing these metal mask changes to make changes to theIROM 210 and MROM 212 can be time consuming and expensive.

Embodiments of the present disclosure allow for immediate implementationof test instructions, commands or macro changes because metal maskchanges to the IROM 210 and MROM 212 are no longer required. Embodimentsof the present disclosure also reduce or eliminate the array efficiencydestroying characteristic of utilizing real estate consuming SRAM 106 tostore test instructions and commands for use by the state machine 102.

FIG. 3 illustrates a memory device 300 adapted to perform a “MacroExecution” function according to one embodiment of the presentdisclosure. The memory device 300 has been simplified to focus on theembodiments of the present disclosure. Memory device 300 is comprised ofa command state machine 308, a state machine 306, a data cache 304,internal busses and signals 310, a macro decode block 312, a controlregister 326, IROM/MROM 338, and an array of memory cells 302.

Memory device 300 can have one or more arrays of FLASH memory cells 302.Embodiments of the present disclosure however are not limited only toFLASH memory. The memory array 302 may be organized in multiple banks ofmemory cells. The memory cells of the memory array 302 are arranged inrows and columns and also may be arranged in either a NAND or a NORconfiguration as is known to those skilled in the art. The memory cellsof the memory array 302 may be multilevel memory cells, single levelmemory cells or a combination of both. Multilevel memory cells takeadvantage of the analog nature of a traditional FLASH cell by assigninga data state (e.g., as represented by a bit pattern) to a specific rangeof threshold voltages stored on the cell. Various embodiments of thepresent disclosure can store macro and operation code (‘op code’) datain memory cells adapted to operate as a single level memory cell. Singlelevel memory cells are typically more reliable and thus well suited tostore data where data integrity and reliability is important.

According to an embodiment of the present disclosure illustrated in FIG.3, data is stored in the array of memory cells 302 at predeterminedlocations wherein the data corresponds to one or more macros 324. Themacro data stored in the array 324 can be loaded as part of thecomponent manufacturing process and can be comprised of arraymaintenance, verification and testing macros.

The state machine 306 and the command state machine 308 may be separatefunctional blocks or may be combined into a single functional statemachine in the memory device 300. The state machine 306 manages theinternal operations of the memory device. For example, external commands314 are received (e.g. from a host processor) and decoded by the commandstate machine 308. The command state machine 308 provides these decodedcommands 332 to the state machine 306. The state machine 306 thenmanages the execution of the intended internal operation(s)corresponding to the received command 314. For example, a command 314 of‘0xbf’ might be decoded as an instruction to the state machine 306 toread macro data 324 stored at a predetermined location in the memoryarray 302. Other commands 314 might be decoded into different internaloperations to be performed. The embodiment is not limited to thecommands discussed here. One skilled in the art could assign variouscommands to be decoded into internal operations to be performed by thestate machine 306.

The state machine 306 according to the embodiment of FIG. 3 is coupledto internal data buses 310. For example, the state machine 306 can becoupled to the Register Data bus (‘REG_DAT<7:0>’) and Register Addressbus (‘REG_ADD <7:0>’) 310. The state machine 306 may also be connectedto various signals present in the memory device 300. For example, statemachine 306 may be coupled to a Write Register (‘WRT_REG’) signal 310.State machine 306 may also be coupled to a state machine oscillator‘SMOSC’ 320 (e.g. clock signal.) State machine 306 may also generate anEnd of Array Read signal 322 upon completion of a read operation. TheEnd of Array Read signal 322 can serve as a Macro Decode Enable signalaccording to some embodiments of the present disclosure. Other signalsmay be present in the various embodiments of the present disclosure asare known to those skilled in the art.

The data cache 304 of FIG. 3 is comprised of a primary data cache (PDC)and a secondary data cache (SDC.) The data cache acts to latch data readfrom the array of memory cells 302. The data cache 304 can also beloaded directly through input/output (I/O) signals 318 of the memorydevice. This allows for data to be loaded directly into the data caches304 without having to perform a read operation of the memory array 302.A typical size of the primary and secondary data caches is 4K bytes.

The control register 326 is comprised of address and data registers usedin the operation of the memory device 300. Different operations andfunctions can be effectuated in the memory device 300 by writing data tothe registers of the control register 326 by utilizing the data signals310.

The macro decode block 312 is coupled to the data cache 304 through aplurality of signals 316. Signals coupling the macro decode block 312and the data cache 304 may be a 16 bit wide data bus as illustrated inFIG. 3. Other bus 316 widths are possible in the various embodiments ofthe present disclosure. The macro decode block 312 is also coupled tointernal busses and signals 310 of the memory device 300. For example,the macro decode block 312 is coupled to the Reg_dat, Reg_add, Wrt_reg,SMOSC 320 and End of Array Read 322 signals. The macro decode block 312reads data latched in the data cache 304 and decodes the data into aform wherein the macro(s) can be executed by the state machine 306. Asdiscussed above, the data cache 304 can be loaded with macro data storedin predetermined locations of the memory array 324 or loaded through theI/O signals 318 of the memory device 300. This flexibility isparticularly helpful during development and debugging phases of thememory device.

During operation of the memory device 300, the command state machine 308may receive an external command 314 corresponding to an instruction toexecute at least one macro stored at a predetermined location 324 of thememory array 302. The stored macros 324 can reside at predeterminedlocations that may or may not be contiguous locations in the memoryarray 302. In response to an external command 314 decoded by the commandstate machine 308, the state machine 306 asserts control of the RegisterAddress and Register Data busses and Write Register signal 310 andperforms a read operation of the macro data stored in the predeterminedlocations 324 of the memory array 302. The read operation managed by thestate machine 306 transfers data stored in the memory array 302 andcopies it into the data cache latches 304. Other commands 314 can bereceived and decoded by the command state machine 308. Upon thecompletion of the read operation to transfer the desired macro datastored in the memory array 302 into the data cache 304, the statemachine 306 releases control of the Register Address and Register Databusses and the Write Register signal 310 and asserts the End of ArrayRead signal 322. The End of Array read signal 322 also serves to enablethe Macro Decode block 312. In one embodiment of the present disclosure,a rising edge of the SMOSC signal 320 directs the macro decode block 312to read data stored in the data cache latches 304 and place the decodedmacro data on the Register Data and Register Address busses 310. Afalling edge of the SMOSC signal 320 triggers a transition of the WriteRegister signal to cause the Register Data and Register Address data tobe latched in the control register 326. Operations within the memorydevice 300 are conducted in part by writing particular data to theregisters of the control register 326. The status of the registers inthe control register 326 control operation of the memory device 300.Other latching and triggering schemes are known to those skilled in theart.

FIG. 4 illustrates an alternate embodiment of a memory device 400according to the present disclosure which illustrates a “Command andMacro Execution” function. The embodiment shown in FIG. 4 is similar tothat of the embodiment of FIG. 3. However, the embodiment of FIG. 4 alsoshows a command, in this case op code data 428 (sometimes referred tosimply as “op code(s)”), stored along with associated macro data 430 inpredetermined locations 424 of the memory array 402. The op code data428 acts as a header for the macro data 430 associated with it.Embodiments of the present disclosure are not limited to command andmacro data being stored in contiguous locations of memory. For example,some or all of the op codes can be stored in one part of the array andsome or all of the associated macro data can be stored in a differentlocation. The memory device 400 has been simplified to focus on theembodiments of the present disclosure.

Memory device 400 is comprised of a command state machine 408, a statemachine 406, a data cache 404, internal busses and signals 410, aCommand/Macro Decode Block 412, a control register 426, MROM/IROM 438and an array of memory cells 402. Memory device 400 is further comprisedof an additional Command Bus 434. The command bus 434 is not limited toany one bus width.

The Command/Macro Decode Block 412 takes data latched in the data cache404 during a read operation and places the information on the RegisterData and Register Address busses 410 according to a predeterminedprocess.

An external (e.g. host) command 414 may be received and decoded by thecommand state machine 408 and is provided to the state machine 406 as adecoded state machine command 432. The command state machine 408 and thestate machine 406 can be separate functional blocks or can be combinedinto a single state machine functional block. The state machine 406manages the intended external command 414 in response to receiving thedecoded state machine command 432. For example, an external command 414of 0xbf corresponding to a ‘read command and macro’ operation might bereceived and decoded by the command state machine 408. The state machine406, upon receiving the decoded ‘read command and macro’ operationinstruction 432 takes control of the Register Data and Register Addressbusses along with the Write Register signal 410. The state machine 406then performs a read operation of a predetermined location 424 of memory402 and transfers the op code 428 and macro data 430 into the data cachelatches 404. Upon completion of the current read operation, the statemachine 406 releases control of the Register Data and Register Addressbusses and the Write Register signal 410 and asserts the End of ArrayRead 422 signal.

The assertion of the End of Array Read signal 422 also serves to enablethe Command/Macro Decode Block 412. The Command/Macro Decode Block 412asserts control over the Register Data and Register Address busses andWrite Register signal 410 in a similar manner as described in theembodiment of FIG. 3. As in the embodiment of FIG. 3, a rising edge ofthe SMOSC signal 420 instructs the Command/Macro Decode Block 412 to putdecoded data read from the data cache 404 on the Register Data andRegister Address busses 410. A falling edge of the SMOSC signal 420triggers a transition of the Write Register signal that causes theRegister Data and Register Address data to be latched in the controlregister 426. The Command/Macro Decode Block 412 can take data from thedata cache 404 and place the data directly on the Register Address andRegister Data busses or additional processing of the data can occurprior to placing it on the Register Data and Register Address busses. Inaddition to taking control of the Register Data and Register Addressbusses 410, the Command/Macro Decode block 412 can also take control ofan additional command bus 434 of the memory device 400. This command bus434 provides decoded op codes to the command state machine 408 that havebeen decoded by the Command/Macro Decode Block 412. The decoded op codeson the command bus 434 can indicate the next operation to be performedby the state machine 406. Table 1 lists for illustration only and not byway of limitation examples of op codes along with a correspondingoperation to be performed by the state machine 406.

TABLE 1 Op Code Operation/Instruction 0000 Register_data 0001Register_address 0010 Write_command 0011 Write_address 0100 Write_data0101 Wait for Ready/Busy_(—) 0110 Read Next Page 0111 Delay/Wait 1010Exit/End execution from array

The embodiment of FIG. 4 decodes the op codes and provides an indicationto the state machine 406 as to what is to be done, if anything, with themacro data following the op code. For example, data stored in apredetermined location 424 of the memory array may be comprised of ‘00111010 1011’. In this example, the first four bits comprise the op code428 corresponding to a “Write_address” command as indicated in Table 1.The remaining eight bits of data 430 are the binary representation ofthe hexadecimal value of 0xAB (1010 1011.) Thus, in the present example,data ‘0011 1010 1011’ having been read from the memory array 402 andprocessed by the Command/Macro Decode Block 412, triggers the statemachine 406 to write a value of 0xAB into the address register of thecontrol register 426. In another example, data bits ‘0110 1010 1011’read from the memory array 402 and processed by the Command/Macro DecodeBlock 412 triggers the state machine 406 to perform a read operation ofanother page from the memory array 402 starting at address 0xAB. Thedata stored at location 0xAB in the present example can be comprised ofadditional command and macro data, macro data alone or neither commandnor macro data. An additional command (e.g., op code ‘1010’ shown inTable 1) can be assigned as an ‘exit’ command which triggers the statemachine 406 to cease reading and executing commands and macros from thememory array 402. Op codes and their corresponding instructionsaccording to the various embodiments of the present disclosure are notlimited to those provided in Table 1. Other variations of op codes andcorresponding instructions are known to those skilled in the art.

As with other embodiments of the present disclosure, the embodiment ofFIG. 4 also provides for loading the data cache 404 directly from I/Oports 418 of the memory device 400. This bypasses the need to perform aread operation of the memory array 402 to load data into the data cache404.

FIG. 5 shows a memory device 500 adapted to execute an “InternalInstruction and Macro Execution” operation according to anotherembodiment of the present disclosure. An internal instruction accordingto the present embodiment differs from a command as illustrated in theembodiment of FIG. 4 in that a command indicates a task to perform withthe macro data that follows the command. For example, the commands givenin Table 1 indicate what the state machine 406 is to do with the datathat follows the command. An internal instruction as shown in theembodiment of FIG. 5 relates to instructions used by the state machine506 to determine the order of implementation of the macros stored 530 inthe memory array. The macros, commands and associated macros andinstructions and associated macros can be of a user mode command type ora test mode command type. Typically, test mode commands are uniquecommands which are only known to or usable by the manufacturer duringproduction.

Memory device 500 comprises a command state machine 508, a state machine506, a data cache 504, internal busses and signals 510, anInstruction/Macro Decode Block 512, a control register 526, IROM/MROM538 and an array of memory cells 502. Memory device 500 furthercomprises an instruction bus 534 and macro bus 536. The bus widths ofthe instruction bus 534, macro bus 536 and the Register Data andRegister Address busses 510 are not limited to any one fixed bus width.

Upon receiving a valid command, the state machine 506 typically loadsinstruction data from the IROM along with macro data from the MROM 538.Similar to embodiments of the present disclosure illustrated in FIGS. 3and 4, the embodiment of FIG. 5 also is adapted to receive an externalcommand 514. This external command 514, according to one embodiment ofthe present disclosure, may be a command which directs the state machine506 not to load instructions or macros from the IROM/MROM 538 (e.g.after power up.) This can be desirable in a production or developmenttesting phase of a memory device 500. This can also be beneficial duringthe production of a memory device wherein test data and routines (e.g.,diagnostic functions) can be programmed into the memory array 502 totest the various internal functions of the memory device 500. Once thedevice has passed the production test routines executed from the memoryarray, the instruction data and macro data can be erased from the memoryarray. The memory device 500 can then be commanded to resort back toexecuting instructions and macros from the IROM/MROM 538 upon receivinga valid command, for example.

Again, similar to the embodiments of the present disclosure asillustrated in FIGS. 3 and 4, the command state machine 508 decodes anexternal (e.g. host) command 514 and provides it 532 to the statemachine 506. The state machine 506 can assert control of the RegisterData and Register Address busses and Write Register signal 510 andexecute a decoded external command 532. For example, a read command canbe performed that reads an op code 528 and associated data 530 stored ina predetermined location 524 of the memory array 502 and transfers theinformation to the data cache 504. Upon completion of the readoperation, the state machine 506 releases control of the Register Dataand Register Address busses and Write Register signal 510 and assertsthe End of Array Read signal 522. The assertion of the End of Array Readsignal 522 serves as an enable signal to the Instruction/Macro DecodeBlock 512. The Instruction/Macro Decode Block 512 then reads the datalatched in the data cache 504. As with other embodiments of the presentdisclosure, data can be manually latched into the data cache 505 fromI/O ports 518 of the memory device thereby eliminating the need toperform a read operation of the memory array 502. Again, this isparticularly advantageous during development and debugging phases of thememory device.

The Instruction/Macro Decode Block 512 is coupled to the data cache 505by a data bus 516 to allow for the transfer of data from the data cache505 to the Instruction/Macro Decode Block 512. In the embodiment of FIG.5, the data bus 516 is shown as 16 bits wide. Other data bus 516 widthsare possible according to the various embodiments of the presentdisclosure.

Once data latched in the data cache 505 has been read by theInstruction/Macro Decode Block 512, the decode block performs a decodeoperation on the information to transform it into Instruction Data andMacro Data. This instruction data and macro data is put on theinstruction data bus 534 And macro data bus 536, respectively. In oneembodiment, the Instruction Data and Macro Data are decoded into aformat that mimics the format of instruction data and macro data storedin the IROM/MROM 538. By mimicking the format of the data stored inIROM/MROM 538 the state machine 506 does not need to be adapted tointerpret multiple formats of instruction data and macro data. Instead,the state machine 506 only requires instruction to either obtaininstruction and macro data from the IROM/MROM 538 or the from the memoryarray 502. The embodiment of FIG. 5 illustrates an instruction data bus534 that is 64 bits wide and a macro data bus 536 that is 16 bits wide.Various embodiments of the present disclosure are not limited to thesebus widths. Additionally, embodiments of the present disclosure allowfor the variation of the sizes of memory array space occupied by op code528 and macro data 530 stored in the memory array 502. A trim value canbe utilized that indicates the transition between op code data 528 andmacro data 530 stored in a given location 524 in the memory array 502.For example, an op code 528 and the associated macro data 530 stored inthe memory array 502 may be comprised of 12 bits. A trim value canindicate that the first four bits are op code data 528 and the remaining8 bits are macro data 530. Other trim values are possible according tothe various embodiments of the present disclosure.

The embodiment of FIG. 5 also illustrates an End of Array Read signal522 and a SMOSC signal 520. As with previous embodiments of the presentdisclosure, the End of Array Read signal can serve as an enable signalto the Instruction/Macro Decode Block 512. Once enabled, theInstruction/Macro Decode Block 512 reads data latched in the data cache505 and according to one embodiment, decodes the data read from the datacache 505 into instruction data and macro data that is then placed onthe instruction bus 534 and macro bus 536. In the present embodimentillustrated in FIG. 5, one transition of the SMOSC 520 signal triggersthe Instruction/Macro Decode Block 512 to read data latched in the datacache 505 and another transition of the SMOSC signal 520 causes decodedinstruction data and macro data to be placed on the instruction bus 534and the macro bus 536.

FIG. 6 illustrates a method of performing an internal operation (e.g.,self test and/or functional operation) on a multi-bank architecturememory device according to one embodiment of the present disclosure. Theflow chart illustrated in FIG. 6 applies to a memory device having twoor more banks of memory cells. Each bank of memory cells of the memoryarray has its own data cache associated with it. Each data cache of thepresent embodiment also contains a PDC and an SDC, each comprised of aplurality of data latches. In one embodiment the PDCs and SDCs have anequal number of latches. Various embodiments of the present disclosureare not limited to PDCs and SDCs comprising equal numbers of latches.

A test program along with test data is loaded into the first bank ofmemory cells. The test program can include macros, commands andinstructions as discussed previously. The test program provides themacros, commands, and/or instructions for the state machine of thememory device to perform the testing operation using the test datastored along with the test program.

Upon receiving a command 600 (e.g. external host command) to perform atest operation, the state machine of the memory device performs a readoperation of the test program stored in the memory array 602. The testprogram read from the memory array can be processed by a macro decodeblock 312, a command/macro decode block 412 or an instruction/macrodecode block 512 according to the various embodiments of the presentdisclosure and as illustrated in FIGS. 3, 4 and 5. The read operation602 and decode operation 604 operation are repeated as long as decisionblock 606 indicates that the array read operation has not beencompleted. When the current read operation is complete as determined indecision block 606, the decoded test program 604 can instruct the statemachine to load test data stored in the first bank of memory cells intoall or a part of the second bank of memory cells 610. In alternateembodiments of the present disclosure, test data may have been loadedinto the first or second bank of memory during a previous operation. Thetest data stored in the first bank of memory cells is loaded (e.g. byperforming a read operation carried out by the state machine) into thePDC of the first bank of memory cells 612. The test data loaded into thePDC 612 is the expected data for the current test procedure beingperformed.

Data from the second bank of memory cells is then loaded (e.g. byperforming a read operation carried out by the state machine) into theSDC of the first bank of memory cells 614. The test data read from thesecond bank of memory cells and loaded into the SDC of the first bank ofmemory cells is the data to be verified (e.g. data under test.) Acomparison 616 of the test data loaded into the PDC of the first bank ofmemory cells is made with the test data loaded in the SDC of the firstbank of memory cells. If the data in the PDC and the SDC matches 618,the memory cells under test from the second bank of memory cells passthe current test 620. If a mismatch is detected, the memory cells of thesecond bank of memory cells associated with the mismatched data can bemarked as defective and blocked from future use 622. If the testprocedure is complete 624, the state machine exits the test operation626. If additional memory needs to be tested, the test procedurecontinues by repeating the test procedure 610.

The verification method according to the present disclosure may berepeated wherein the test data is inverted in order to detect anydefective memory cells that always read back at a fixed value. Forexample, for the first test run, data such as ‘1010’ can be used. Forthe second run of the test, data such as ‘0101’ can be used. This allowsfor testing of multiple possible data states in the memory device. Otherpatterns of data may be used according to the various embodiments of thepresent disclosure. Such patterns may be utilized to test memory devicesthat are configured to operate as single level memory cells, multi-levelmemory cells or a combination thereof.

Once all the memory cells of the second bank of memory cells have beentested 626, the process may be repeated wherein the second bank ofmemory cells and its associated data cache (e.g. PDC and SDC) is nowused to test the first bank of memory cells. This testing method can beexpanded to test memory devices having more than two banks of memorycells.

FIG. 7 illustrates a test method of a memory device having a singlememory bank architecture according to another embodiment of the presentdisclosure. According to the present embodiment, a test program and testdata is loaded into part or all of the single bank of memory. Expectedtest data in this embodiment of the present disclosure can be loadedinto the PDC through the I/O ports of the memory device 710. Uponreceiving a command 700 (e.g. external host command), the state machineperforms a read operation of the single bank of memory of the memorydevice 702. The test program read from the memory array is processed bya macro decode block 312, a command/macro decode block 412 or aninstruction/macro decode block 512 according to the various embodimentsof the present disclosure and as illustrated in FIGS. 3, 4 and 5. Theread operation 702 and decode operation 704 operation are repeated aslong as decision block 706 indicates that the array read operation hasnot been completed. Once the read operation of the memory array iscomplete as determined in decision block 706, expected test data isloaded into the PDC through the I/O ports of the memory device 710. Testdata previously stored and read from memory cells of the memory array isloaded into the SDC 712. A comparison 714 is made of the expected dataloaded into the PDC through the I/O ports and the data loaded into theSDC read from the memory array. This comparison 716 is performed todetect any defective memory cells in the array. Memory cells that aredetermined to be defective can be blocked from future use by the memorydevice 720. Memory cells whose test data stored in the SDC matches theexpected data in the PDC pass the verification test 718. The method ofthe present embodiment is not limited to expected data being stored inthe PDC and data under test stored in the SDC. For example, the expecteddata loaded through the I/O ports might be loaded into the SDC and thedata read from the memory device might be loaded into the PDC.

Again, the verification method according to the present disclosure andillustrated in FIG. 7 may be repeated wherein the test data is invertedin order to detect any defective memory cells that always read back at afixed value. For example, for the first test run, data such as ‘1010’can be used. For the second run of the test, data such as ‘0101’ can beused. This allows for testing of multiple possible data states in thememory device. Other patterns of data can be used according to thevarious embodiments of the present disclosure. Such patterns may beutilized to test memory devices that are configured to operate as singlelevel memory cells, multi-level memory cells or a combination thereof.When the current testing operation is complete as determined in decisionblock 722, the process ends 724.

FIG. 8 illustrates another test method of a memory device according toan embodiment of the present disclosure having a single bank of memorycells. As discussed with respect to other embodiments of the presentdisclosure, a test program and test data is loaded into the memory arrayof the memory device. Upon receiving a command 800 (e.g. external hostcommand), the state machine performs a read operation 802 of thelocation in the memory wherein the test program is residing. A decodeoperation is performed 804 on the data read from the memory array. Thetest program read from the memory array can be processed by a macrodecode block 312, a command/macro decode block 412 or aninstruction/macro decode block 512 according to the various embodimentsof the present disclosure and as illustrated in FIGS. 3, 4 and 5. Theread operation 802 and decode operation 804 operation are repeated aslong as decision block 806 indicates that the array read operation hasnot been completed. Upon completion of the read operation of the memoryarray as determined in decision block 806, the state machine loads testdata that was previously stored in the memory array into a firstlocation in the memory array to be tested 808. The test data loaded intothe memory array may fill the remainder of the memory device with testdata or only a portion of the memory device may be loaded with testdata. Test data is then read from the memory array and loaded into thePDC of the memory array 812. Test data comprising expected datapreviously loaded along with the test program is then read and loadedinto the SDC of the memory array 814. A comparison of the data in thePDC and SDC is performed 816. The data stored in the PDC and SDC, whencompared, should be equal assuming no errors occurred in the readoperation due to defective memory cells under test. A match of the datastored in the PDC and SDC indicates a “Pass” result for the memory undertest 820. Bad memory cells identified during the comparison 818 areblocked from future use 822.l The test program is repeated until allmemory cells in the array have been tested 824 at which point theprocess ends 826.

As discussed regarding other embodiments of the present disclosure, thetest procedure may be repeated using inverted data and additional datapatterns may be utilized to test memory cells adapted to perform assingle or multi level cells. Other embodiments may restrict that memorycells used to store test programs and test data are only operated assingle level memory cells due to the improved reliability of singlelevel cells over cells configured to operate as multi-level cells. Thelocations of bad memory cells identified during performance of the testprograms 822 according to embodiments of the present disclosure can bestored in the memory array. Then, as part of a power up procedure of thememory device, the locations of these bad memory cells can be read fromthe array to prevent their use by the memory device during normaloperation.

FIG. 9 shows an embodiment of the present disclosure having memorydevice 900 adapted to perform multiple tasks, for example those ofmultiple other embodiments. The memory device 900 shares manysimilarities with previous embodiments shown in FIGS. 3, 4 and 5. A databus 916 having a bus width of 16 bits couples the decode block 912 andthe data cache 904. Other bus widths are possible as is known in theart. The decode block 912 comprises a Macro Decode Block 940, aInstruction/Macro Decode Block 942 and a Command/Macro Decode Block 944.The decode block 912 may be comprised of a plurality of state machinesto implement the Macro Decode 940, Instruction/Macro Decode 942 and theCommand/Macro Decode 944 Blocks. Alternate embodiments allow for asingle state machine adapted to incorporate the three decode blocks 940,942 and 944. A received external command 914 (e.g. external hostcommand), when decoded 932, provides an indication as to which decodeblock (e.g. 940, 942, 944) is to be utilized. Additional embodimentsallow for macros 924, op codes 928 and data 930 read from the memoryarray 902 to provide an indication as to which decode blockfunctionality is to be utilized.

FIG. 9 further illustrates that an external command 914 can be receivedand decoded by a command state machine 908 which is then provided to thestate machine 906 as a decoded state machine command 932. The commandstate machine 908 and the state machine 906 can be separate functionalblocks or can be combined into a single state machine functional block.IROM/MROM 938 is also shown coupled to state machine 906 along with theSMOSC 920 signal. The End Of Array Read signal 922 generated by thestate machine 906 also serves as an enable signal for the decode block912. The Register Data, Register Address and Write Register signals,collectively represented at 910 in FIG. 9, are coupled to the statemachine 906, the command/macro decode block 944, control register 926and macro decode block 940. The I/O ports 918 allow for direct access tothe data cache 904 according to the various embodiments of the presentinvention. The command/macro decode block provides a decoded command 946to the state machine 906 as discussed in regards to the embodiment ofFIG. 4. Decoded instruction 934 and macro 936 data are also provided tothe state machine 906 as discussed according to the embodiment of FIG. 5

Various bus widths are illustrated in FIG. 9. For example, the decodedinstruction bus 934 is shown in FIG. 9 to be 64 bits wide. However, theembodiments of the present disclosure are not restricted to the buswidths shown in FIG. 9. As is known in the art, bus widths can beadjusted to fit a particular application.

FIG. 10 is a functional block diagram of an electronic system having atleast one memory device according to an embodiment of the presentdisclosure. The memory device 1000 is coupled to a processor 1010. Theprocessor 1010 can be a microprocessor or some other type of controllingcircuitry. The memory device 1000 and the processor 1010 form part of anelectronic system 1020. The memory device 1000 has been simplified tofocus on features of the memory that are helpful in understanding thepresent invention.

The memory device includes an array of memory cells 1030 that can bearranged in banks of rows and columns

An address buffer circuit 1040 is provided to latch address signalsprovided on address input connections A0-Ax 1042. Address signals arereceived and decoded by a row decoder 1044 and a column decoder 1046 toaccess the memory array 1030. It will be appreciated by those skilled inthe art, with the benefit of the present description, that the number ofaddress input connections depends on the density and architecture of thememory array 1030. That is, the number of addresses increases with bothincreased memory cell counts and increased bank and block counts.

The memory device 1000 reads data in the memory array 1030 by sensingvoltage or current changes in the memory array columns using sense/datacache circuitry 1050. The sense/data cache circuitry 1050, in oneembodiment, is coupled to read and latch a row of data from the memoryarray 1030. Data input and output buffer circuitry 1060 is included forbi-directional data communication over a plurality of data connections1062 with the controller 1010. Write circuitry 1055 is provided to writedata to the memory array 1030.

Control circuitry 1070 is comprised in part of the various structures orfeatures of the embodiments of the present disclosure. For example,control circuitry 1070 an include a command state machine, statemachine, control registers and various decode blocks (e.g. macro,command/macro and instruction/macro decode blocks) according to theembodiments of the present disclosure. Control signals and commands canbe sent to the memory device over the command bus 1072. The command bus1072 may be a discrete signal or may be comprised of multiple signals(e.g. command bus). These command signals 1072 are used to control theoperations on the memory array 1030, including data read, data write(program), and erase operations.

The memory device illustrated in FIG. 10 has been simplified tofacilitate a basic understanding of the features of the electronicsystem. A more detailed understanding of internal circuitry andfunctions of memories are known to those skilled in the art.

Conclusion

Various embodiments of the present disclosure provide methods forexecuting internal memory device operations using instructions and datastored in the memory array of the memory device. The various embodimentsalso disclose apparatus adapted to perform the internal memory deviceoperations executed from the memory array. These operations can includeoperations for testing memory devices during development, verificationand production phases of the memory device.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement, which is calculated to achieve the same purpose,may be substituted for the specific embodiments shown. This applicationis intended to cover any adaptations or variations of the presentinvention. Therefore, it is manifestly intended that this invention belimited only by the claims and the equivalents thereof.

1. A method of performing an internal operation on a memory devicecomprising: storing data in a data cache, wherein the data stored in thedata cache corresponds to at least one internal operation function;performing a decode operation on the data stored in the data cache,wherein the decode operation generates an internal operation functioncommand; and providing the decoded internal operation function commandto a state machine adapted to perform the decoded internal operationfunction command.
 2. The method of claim 1, wherein the internaloperation function command comprises an instruction and an associatedmacro.
 3. The method of claim 1, wherein storing data in the data cachecomprises, in response to a first received command signal, performing aread operation of data corresponding to at least one internal operationfunction previously stored in an array of memory cells of the memorydevice.
 4. The method of claim 3, wherein the decode operation occurs inresponse to an end of array read signal generated by the state machine,wherein the end of array read signal is generated upon completion of theread operation.
 5. The method of claim 3, wherein performing a readoperation further comprises performing a read operation on the array ofmemory cells where the read operation is controlled by the statemachine.
 6. The method of claim 1, wherein storing data in the datacache comprises loading data from input ports of the memory device inresponse to a second received command signal.
 7. The method of claim 1,wherein storing data in the data cache comprises storing data in thedata cache in response to an externally received command signal.
 8. Themethod of claim 1, wherein performing an internal operation on thememory device further comprises performing an internal diagnosticoperation on the memory device.
 9. The method of claim 1, whereinperforming an internal operation on the memory device further comprisesperforming an internal operation on a NAND configured memory device. 10.The method of claim 1, further comprising programming one or more opcodes and associated data in predetermined locations of the memory arrayprior to performing the decode operation on data stored in the datacache.
 11. The method of claim 10, wherein programming one or more opcodes and associated data further comprises programming one or more opcodes and associated data in predetermined locations of the memory arraywhere the predetermined locations comprise memory cells adapted tooperate as single level memory cells.
 12. An electronic systemcomprising: a processor for generating memory control signals; and amemory device coupled to the processor and adapted to utilize the memorycontrol signals, wherein the memory device comprises: an array of memorycells; an internal address bus; an internal data bus; a data cache thatstores data copied from the memory array during a memory array readoperation; and control circuitry, wherein the control circuitrycomprises: a decoder adapted to read data in the data cache having beencopied from locations of the memory array during a memory array readoperation, decode the data read from the data cache, and output decodedinstructions on the internal address and internal data busses; and astate machine, coupled to the internal address and internal data bussesand adapted to perform the decoded instructions on the memory device.13. The electronic system of claim 12 further comprising I/O ports thatare coupled to the data cache wherein the I/O ports and data cache areadapted to allow programming of the data cache without copying data fromthe memory array.
 14. The electronic system of claim 12, wherein thedata copied from locations of the memory array comprises op code dataand macro data.
 15. The electronic system of claim 12, wherein thedecoder is enabled in response to receiving an end of array read signalgenerated by the state machine.
 16. The electronic system of claim 15,wherein the decoder is further adapted to read data in the data cachewhen the decoder is enabled.
 17. The electronic system of claim 12,wherein the decoder is further adapted to decode the data read from thedata cache into instruction data and macro data.
 18. The electronicsystem of claim 12, wherein the control circuitry is adapted to programone or more op codes and associated data in predetermined locations ofthe array of memory cells.
 19. The electronic system of claim 18,wherein the predetermined locations in memory comprise memory cellsadapted to operate as single level memory cells.
 20. The electronicsystem of claim 18, wherein the associated data comprises macro dataassociated with each op code of the one or more op codes programmed inthe predetermined locations of the array of memory cells.